Cover
Title Thermal management of microelectronic equipment : heat transfer theory, analysis methods and design practices
Author Lian-Tuu Yeh, Richard C. Chu, Dereje Agonafer
Year 2002
Edition 1st
Volume
Series ASME Press book series on electronic packaging
Publisher ASME Press
City New York
Language English
Size: 5.36MB | Pages: 414 | LLC: N/A | DDC:
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